Semiconductors

The Biden-Harris Administration has awarded Intel Corporation up to $3 billion in direct funding under the CHIPS and Science Act for a capability known as the “Secure Enclave.” The funding will support the manufacturing of microelectronics and ensure access to a domestic supply chain of advanced semiconductors for national security. The award will be executed by the Department of Defense (DoD) per an agreement between the Department of Commerce and the DoD.

The U.S. National Science Foundation, in partnership with Ericsson, Intel Corporation, Micron Technology and Samsung, announced $42.4 million in grants for its Future of Semiconductors competition. The investment will fuel research and education across various semiconductor technologies, advancing U.S. leadership in semiconductor research and innovation and addressing challenges, including emerging computing tasks and applications, energy efficiency, performance, manufacturing and supply chains.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to strengthen domestic supply chain resilience, advance our national security, and bolster U.S. competitiveness in current-generation and mature-node semiconductor production.

The U.S. National Science Foundation and Intel Corporation announced a $7.6 million investment in six projects to advance equitable STEM education and training opportunities that strengthen the nation's semiconductor workforce.

The Biden-Harris Administration announced that the U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms to provide up to $450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility.

The U.S. National Science Foundation, in partnership with Australia's national science agency, Commonwealth Scientific and Industrial Research Organisation, are investing in solutions that will accelerate the transition of materials development, manufacturing, and use to a circular economy, positively impacting multiple industries such as semiconductors and plastics.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Amkor Technology, Inc. have signed a non-binding preliminary memorandum of terms to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.

The U.S. National Science Foundation and the CHIPS for America Research and Development Office within the National Institute of Standards and Technology, a bureau of the U.S. Department of Commerce, signed a memorandum of understanding to jointly invest in a new initiative to train the future semiconductor workforce at all levels for myriad job types across industry and the nation.