Semiconductors

The Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the CHIPS and Science Act to solidify U.S. leadership in semiconductor-grade polysilicon production. The proposed funding would support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon carbide wafer manufacturing facility in Siler City, North Carolina, helping to secure a reliable domestic supply of the semiconductors.

The U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new sustainable semiconductor materials and processes that meet industry needs and can be designed and adopted within five years. CHIPS for America anticipates up to $100 million in funding to award recipients that develop university-led, industry-informed, collaborations about artificial intelligence-powered autonomous experimentation (AI/AE).

The U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123 million in direct funding to Polar Semiconductor (Polar).

The Biden-Harris Administration has awarded Intel Corporation up to $3 billion in direct funding under the CHIPS and Science Act for a capability known as the “Secure Enclave.” The funding will support the manufacturing of microelectronics and ensure access to a domestic supply chain of advanced semiconductors for national security. The award will be executed by the Department of Defense (DoD) per an agreement between the Department of Commerce and the DoD.

The U.S. National Science Foundation, in partnership with Ericsson, Intel Corporation, Micron Technology and Samsung, announced $42.4 million in grants for its Future of Semiconductors competition. The investment will fuel research and education across various semiconductor technologies, advancing U.S. leadership in semiconductor research and innovation and addressing challenges, including emerging computing tasks and applications, energy efficiency, performance, manufacturing and supply chains.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to strengthen domestic supply chain resilience, advance our national security, and bolster U.S. competitiveness in current-generation and mature-node semiconductor production.

The U.S. National Science Foundation and Intel Corporation announced a $7.6 million investment in six projects to advance equitable STEM education and training opportunities that strengthen the nation's semiconductor workforce.