Executive Office of the President

President Joe Biden proclaimed tomorrow, Oct. 4, 2024, National Manufacturing Day. “I thank our manufacturing workers for all that they do to strengthen our Nation, encourage all Americans to look for ways to get involved in their communities, and call on everyone to join me in participating in National Manufacturing Day and, most importantly, buying American.”

The Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from R&D activities to commercial manufacturing operations.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to strengthen domestic supply chain resilience, advance our national security, and bolster U.S. competitiveness in current-generation and mature-node semiconductor production.

The U.S. Department of Energy, through the Office of Manufacturing and Energy Supply Chains, announced $50 million for six states with significant automotive workforces to help small- and medium-sized suppliers adapt manufacturing facilities for the electric vehicle supply chain, helping to maintain good-paying, union jobs in traditional auto communities.

The U.S. Department of Energy announced a $2.2 billion investment in the nation’s grid for eight projects across 18 states to protect against growing threats of extreme weather events, lower costs for communities, and catalyze additional grid capacity to meet load growth stemming from an increase in manufacturing and data centers.

The Biden-Harris Administration announced that the U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms to provide up to $450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility.

The U.S. Department of Energy (DOE) today announced the availability of up to $63 million to enable state and local governments to expand battery recycling and modernize American manufacturing by making cutting edge technologies like advanced sensors and modeling more accessible to small- and medium-sized manufacturers.

The U.S. Department of Energy today announced 21 new projects selected to receive $24 million from the Bipartisan Infrastructure Law to bolster the development of clean energy workforce training programs – with a focus on jobs that do not require a four-year degree – within union training programs, community colleges, and trade schools across the country.