Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon
The Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $325 million in proposed direct funding under the CHIPS and Science Act to solidify U.S. leadership in semiconductor-grade polysilicon production. The proposed funding would support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan.