Microelectronics

The U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina. The new institute, known as SMART USA (Semiconductor Manufacturing and Advanced Research with Twins USA) will focus on efforts to develop, validate, and use digital twins.

The U.S. National Science Foundation, in partnership with Ericsson, Intel Corporation, Micron Technology and Samsung, announced $42.4 million in grants for its Future of Semiconductors competition. The investment will fuel research and education across various semiconductor technologies, advancing U.S. leadership in semiconductor research and innovation and addressing challenges, including emerging computing tasks and applications, energy efficiency, performance, manufacturing and supply chains.

The Biden-Harris Administration has awarded Intel Corporation up to $3 billion in direct funding under the CHIPS and Science Act for a capability known as the “Secure Enclave.” The funding will support the manufacturing of microelectronics and ensure access to a domestic supply chain of advanced semiconductors for national security. The award will be executed by the Department of Defense (DoD) per an agreement between the Department of Commerce and the DoD.

The Department of Defense announced a three-year, $9.5 million award to create and improve microelectronics-focused education training centers in Indiana with non-profit Regional Opportunity Initiatives, Inc. This award was made by the Industrial Base Analysis and Sustainment program through the Cornerstone Other Transaction Agreement, which are overseen by the Deputy Assistant Secretary of Defense for Industrial Base Resilience’s Manufacturing Capability Expansion and Investment Program.

The Department of Defense announced a $25.8 million award to Honeywell in Plymouth, Minnesota to produce or acquire trusted strategic radiation-hardened microelectronics. The funds will be used for strategic radiation-hardened microelectronics fabrication via a Defense Microelectronics Activity-accredited manufacturing process and support 90nm technology development in Honeywell's Minnesota microelectronics foundry.

The U.S. National Science Foundation and the CHIPS for America Research and Development Office within the National Institute of Standards and Technology, a bureau of the U.S. Department of Commerce, signed a memorandum of understanding to jointly invest in a new initiative to train the future semiconductor workforce at all levels for myriad job types across industry and the nation.

The U.S. Department of Commerce issued a Notice of Intent to open a competition for new research and development activities that will establish and accelerate domestic capacity for semiconductor advanced packaging.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Rogue Valley Microdevices have signed a non-binding preliminary memorandum of terms to provide up to $6.7 million in proposed direct funding under the CHIPS and Science Act.