Federal Announcements

The Biden-Harris Administration has awarded Intel Corporation up to $3 billion in direct funding under the CHIPS and Science Act for a capability known as the “Secure Enclave.” The funding will support the manufacturing of microelectronics and ensure access to a domestic supply chain of advanced semiconductors for national security. The award will be executed by the Department of Defense (DoD) per an agreement between the Department of Commerce and the DoD.

The Department of Defense today announced 12 additional awards to bioindustrial firms via the Distributed Bioindustrial Manufacturing Program (DBIMP). This announcement brings the DBIMP to 25 awards to date totaling $42 million.

The Department of Defense announced a three-year, $9.5 million award to create and improve microelectronics-focused education training centers in Indiana with non-profit Regional Opportunity Initiatives, Inc. This award was made by the Industrial Base Analysis and Sustainment program through the Cornerstone Other Transaction Agreement, which are overseen by the Deputy Assistant Secretary of Defense for Industrial Base Resilience’s Manufacturing Capability Expansion and Investment Program.

The U.S. Department of Energy announced an additional $9 million investment in the Industrial Training and Assessment Centers (ITAC) Implementation Grants program. This funding would support 47 small- and medium-sized manufacturers across the country to implement a wide variety of energy and efficiency projects, including installing onsite solar and heat pumps, improving lighting and heating, and electrifying industrial equipment and fleets.

The U.S. Department of Energy today announced $40 million in investments across the solar energy supply chain, including the selection of four projects to improve the lifecycle of photovoltaic solar systems. These investments will support the Biden-Harris Administration’s efforts to boost domestic manufacturing and competitiveness while reducing waste and improving sustainability of solar technologies.

The U.S. Department of Commerce’s Economic Development Administration is awarding a $2.5 million grant to the County of Oswego Industrial Development Agency in Oswego, New York, to support the growing manufacturing and semiconductor industries in the region.

The Department of Defense announced a $25.8 million award to Honeywell in Plymouth, Minnesota to produce or acquire trusted strategic radiation-hardened microelectronics. The funds will be used for strategic radiation-hardened microelectronics fabrication via a Defense Microelectronics Activity-accredited manufacturing process and support 90nm technology development in Honeywell's Minnesota microelectronics foundry.

Artificial Intelligence is transforming research, education, manufacturing and everyday life. To prepare the next generation of talent for a diverse, well-trained AI workforce, the U.S. National Science Foundation directorates for Computer and Information Science and Engineering (CISE) and STEM Education launched the NSF EducateAI initiative. This program aims to make state-of-the-art, inclusive AI educational experiences available nationwide.

The Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region.

The Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from R&D activities to commercial manufacturing operations.